Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC

Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation …

CPV: 38000000 Equipo de laboratorio, óptico y de precisión (excepto gafas), 38400000 Instrumentos de medida o control de características físicas, 38500000 Aparatos de control y prueba, 38900000 Instrumentos de evaluación o ensayo diversos, 38800000 Equipo de control de procesos industriales y equipo con mando a distancia, 38300000 Instrumentos de medición, 38600000 Instrumentos ópticos
Lugar de ejecución:
Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC
Organismo adjudicador:
University College Cork
Número de premio:
UCC-2024-09

1. Buyer

1.1 Buyer

Official name : University College Cork
Legal type of the buyer : Body governed by public law
Activity of the contracting authority : Education

2. Procedure

2.1 Procedure

Title : Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC
Description : Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.
Procedure identifier : 09213d57-e477-4a8d-b302-8bf7564906af
Previous notice : 4d0e7264-261a-4899-8ddd-2dcb3e86c0ba-01
Type of procedure : Open
The procedure is accelerated : no
Justification for the accelerated procedure :
Main features of the procedure :

2.1.1 Purpose

Main nature of the contract : Supplies
Main classification ( cpv ): 38000000 Laboratory, optical and precision equipments (excl. glasses)
Additional classification ( cpv ): 38400000 Instruments for checking physical characteristics
Additional classification ( cpv ): 38500000 Checking and testing apparatus
Additional classification ( cpv ): 38900000 Miscellaneous evaluation or testing instruments
Additional classification ( cpv ): 38800000 Industrial process control equipment and remote-control equipment
Additional classification ( cpv ): 38300000 Measuring instruments
Additional classification ( cpv ): 38600000 Optical instruments

2.1.2 Place of performance

Country subdivision (NUTS) : Dublin ( IE061 )
Country : Ireland

2.1.3 Value

Estimated value excluding VAT : 81 000 Euro

2.1.4 General information

Legal basis :
Directive 2014/24/EU

5. Lot

5.1 Lot technical ID : LOT-0001

Title : Supply, Delivery and Commissioning of a High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC
Description : Tenders are sought for the supply and delivery of High-Precision Wafer Lapping and Polishing System for Tyndall National Institute, UCC. Miniaturisation and integration are key themes across all areas of Tyndall’s research. Development of next generation technologies requires ever decreasing device sizes coupled with ever-increasing functionality. The task of miniaturisation beings with device design and fabrication where sub-micron technologies are now industry standard, and the development of nanoscale processes is progressing rapidly. The challenges of miniaturisation extend onwards to the back-end processes where the removal of unused bulk semiconductor material through precision lapping and polishing is essential to minimising the size of a final device. Tyndall now wishes to enhance its back-end processing capability through the procurement of a high-precision wafer lapping and polishing system for use with silicon, III-V and other semiconductor materials.
Internal identifier : 0

5.1.1 Purpose

Main nature of the contract : Supplies
Main classification ( cpv ): 38000000 Laboratory, optical and precision equipments (excl. glasses)
Additional classification ( cpv ): 38400000 Instruments for checking physical characteristics
Additional classification ( cpv ): 38500000 Checking and testing apparatus
Additional classification ( cpv ): 38900000 Miscellaneous evaluation or testing instruments
Additional classification ( cpv ): 38800000 Industrial process control equipment and remote-control equipment
Additional classification ( cpv ): 38300000 Measuring instruments
Additional classification ( cpv ): 38600000 Optical instruments

5.1.2 Place of performance

Country subdivision (NUTS) : Dublin ( IE061 )
Country : Ireland
Additional information :

5.1.5 Value

Estimated value excluding VAT : 81 000 Euro

5.1.6 General information

Procurement Project not financed with EU Funds.
The procurement is covered by the Government Procurement Agreement (GPA) : yes

5.1.7 Strategic procurement

Aim of strategic procurement : No strategic procurement

5.1.10 Award criteria

Criterion :
Type : Quality
Name :
Description : Technical Merit
Weight (points, exact) : 400
Criterion :
Type : Quality
Name :
Description : Quality and Health and Safety
Weight (points, exact) : 50
Criterion :
Type : Quality
Name :
Description : After Sales Technical Support, Warranty and Training
Weight (points, exact) : 100
Criterion :
Type : Quality
Name :
Description : Delivery Plan
Weight (points, exact) : 50
Criterion :
Type : Quality
Name :
Description : Sustainability
Weight (points, exact) : 50
Criterion :
Type : Cost
Name :
Description : Ultimate Cost (Total Cost of Ownership) Including
Weight (points, exact) : 350
Description of the method to be used if weighting cannot be expressed by criteria :
Justification for not indicating the weighting of the award criteria :

5.1.15 Techniques

Framework agreement :
No framework agreement
Information about the dynamic purchasing system :
No dynamic purchase system

5.1.16 Further information, mediation and review

Review organisation : The High Court of Ireland
Organisation providing offline access to the procurement documents : University College Cork
TED eSender : European Dynamics S.A.

6. Results

Value of all contracts awarded in this notice : 81 450 Euro

6.1 Result lot ldentifier : LOT-0001

At least one winner was chosen.

6.1.2 Information about winners

Winner :
Official name : Logitech
Tender :
Tender identifier : 000060817
Identifier of lot or group of lots : LOT-0001
Subcontracting : No
Contract information :
Identifier of the contract : 410587
Date on which the winner was chosen : 15/07/2024
Date of the conclusion of the contract : 16/09/2024
The contract is awarded within a framework agreement : no

8. Organisations

8.1 ORG-0001

Official name : University College Cork
Registration number : IE0006286E
Postal address : University College Cork, 6 Elderwood, College Road
Town : Cork
Postcode : T12 VH39
Country : Ireland
Telephone : +353 21 4903514
Internet address : https://www.ucc.ie
Buyer profile : https://www.ucc.ie
Roles of this organisation :
Buyer
Organisation providing offline access to the procurement documents

8.1 ORG-0002

Official name : Logitech
Registration number : SC042330
Postal address : Erskine Ferry Road
Town : Glasgow
Postcode : G60 5EU
Country : United Kingdom
Telephone : 00447786332822
Internet address : www.logitech.uk.com
Roles of this organisation :
Tenderer
Winner of these lots : LOT-0001

8.1 ORG-0003

Official name : The High Court of Ireland
Registration number : The High Court of Ireland
Department : The High Court of Ireland
Postal address : Four Courts, Inns Quay, Dublin 7
Town : Dublin
Postcode : D07 WDX8
Country : Ireland
Telephone : +353 1 8886000
Roles of this organisation :
Review organisation

8.1 ORG-0004

Official name : European Dynamics S.A.
Registration number : 002024901000
Department : European Dynamics S.A.
Town : Athens
Country : Greece
Telephone : +30 2108094500
Roles of this organisation :
TED eSender

11. Notice information

11.1 Notice information

Notice identifier/version : f556fba3-518a-49b7-9b48-9cd7c345c41b - 01
Form type : Result
Notice type : Contract or concession award notice – standard regime
Notice dispatch date : 30/09/2024 11:55 +01:00
Languages in which this notice is officially available : English

11.2 Publication information

Notice publication number : 00589516-2024
OJ S issue number : 191/2024
Publication date : 01/10/2024